Organic light-emitting display device having touchscreen and method of manufacturing the same

ABSTRACT

Disclosed is an organic light-emitting display device having a touchscreen in which the configuration of a pad unit and a circuit board connected to the pad unit is simplified, resulting in bonding stability and an improved form factor of the device, and a method of manufacturing the same. In the organic light-emitting display device having the touchscreen in which a touch electrode is directly provided on an encapsulation layer, a touch pad and a display pad are disposed parallel to each other on the same side so as to be connected to a flexible printed circuit board with a difference in height therebetween. Thereby, increased bonding reliability and an increased effective display area are achieved.

CROSS-REFERENCE TO RELATED APPLICATION

This application claims the benefit of Korean Patent Application No.10-2017-0070901, filed on Jun. 7, 2017, which is hereby incorporated byreference in its entirety as if fully set forth herein.

BACKGROUND Field of the Disclosure

The present disclosure relates to a display device, and moreparticularly, to an organic light-emitting display device and a methodof manufacturing the same to have a touchscreen in which theconfiguration of a pad unit and a circuit board connected to the padunit is simplified, resulting in bonding stability and an improved formfactor of the device.

Description of the Background

A touchscreen is an input device that is disposed on a display deviceand allows a user to input a command by selecting a content appearing ona screen of a display device or the like with the human hand or anobject. That is, the touchscreen converts a contact position that thehuman hand or the object directly touches into an electrical signal, andreceives the content selected at the contact position as an inputsignal. The touchscreen may eliminate a separate input device, which isconnected to the display device and operates, such as a keyboard or amouse, and thus the use range thereof is gradually expanding.

Such a touchscreen is generally attached to the front surface of adisplay panel, such as a liquid crystal display panel or an organiclight-emitting diode display panel, via an adhesive. In this case, sincethe touchscreen is separately manufactured and attached to the frontsurface of the display panel, the manufacturing process becomescomplicated due to the addition of such an attachment process. Moreover,upon attachment of such different types of panels, misalignment or thelike may deteriorate yield, which causes increase in processing burdenand costs.

SUMMARY

Accordingly, the present disclosure is directed to an organiclight-emitting display device having a touchscreen and a method ofmanufacturing the same that substantially obviate one or more problemsdue to limitations and disadvantages of the related art.

The present disclosure has been provided to solve the problems describedabove, and an object of the present disclosure is to provide an organiclight-emitting display device having a touchscreen in which theconfiguration of a pad unit and a circuit board connected to the padunit is simplified, resulting in bonding stability and an improved formfactor of the device, and a method of manufacturing the same.

Additional advantages and features of the disclosure will be set forthin part in the description which follows and in part will becomeapparent to those having ordinary skill in the art upon examination ofthe following or may be learned from practice of the disclosure. Theother advantages of the disclosure may be realized and attained by thestructure particularly pointed out in the written description and claimshereof as well as the appended drawings.

To achieve these and other advantages and in accordance with the purposeof the disclosure, as embodied and broadly described herein, in anorganic light-emitting display device having a touchscreen, a displaypad and a touch pad for a touchscreen are provided on the same side of asubstrate through a common formation process, whereby easy arrangementas well as connection stability due to the prevention of a difference inheight between the pads and a circuit board may be achieved.

In accordance with one aspect of the present disclosure, an organiclight-emitting display device includes a substrate including an activearea and a non-active area, a plurality of thin-film transistorsdisposed in the active area, a plurality of light-emitting elementsconnected to the respective thin-film transistors in the active area, anencapsulation layer configured to cover the thin-film transistors andthe light-emitting elements, a touch electrode array including aplurality of first touch electrodes and second touch electrodes arrangedon the encapsulation layer to intersect each other in the active area, aplurality of display pads and a plurality of touch pads arranged in thenon-active area on a same side of the substrate so as to be parallel toand spaced apart from each other, and a flexible printed circuit boardconnected both to the display pads and to the touch pads.

The organic light-emitting display device further includes a pluralityof touch link wires provided in the non-active area above theencapsulation layer on the substrate and configured to connect the touchpads to the first touch electrodes and the second touch electrodes,respectively, and a plurality of display link wires provided in thenon-active area below the encapsulation layer on the substrate andconfigured to connect the display pads to the thin-film transistors,respectively.

The touch link wires and the display link wires ma include anoverlapping portion by interposing the encapsulation layer therebetween.

Each first touch electrode may include a first touch pattern and a firstbridge, each second touch electrode may include a second touch patternand a second bridge, the first touch pattern and the second touchpattern may be in the same layer, the first bridge may be integratedwith the first touch pattern, and the second bridge may be located in alayer different from the first touch pattern and the second touchpattern interposing a touch insulation layer therebetween at anintersection of the first touch electrode and the second touchelectrode, and may be connected to the second touch pattern through atouch connection hole formed in the touch insulation layer.

Each touch pad may include touch pad electrodes in multiple layers, andeach touch link wire may be located in the same layer as the secondbridge, and may be integrated with the touch pad electrode forming atleast one layer of the touch pad.

Each touch pad may include touch pad electrodes in multiple layers, eachtouch link wire may be located in the same layer as the first bridge,and at least one touch pad electrode constituting the touch pad may belengthened so as to be connected to the touch link wire.

Each touch pad may include touch pad electrodes in multiple layers, theorganic light-emitting display device may further include one or moreinsulation layers between the touch link wires and at least one touchpad electrode of the touch pad, and each touch link wire may beelectrically connected to the at least one touch pad electrode through aconnection hole formed in the one or more insulation layers.

The one or more insulation layers between the touch link wires and theat least one touch pad electrode of the touch pad may be inorganiclayers.

Each display pad may include a first display pad electrode in the samelayer as the thin-film transistors and a second display pad electrode ina layer different from the first display pad electrode, and each touchpad may include a first touch pad electrode in the same layer as thefirst display pad electrode and a second touch pad electrode in the samelayer as the second display pad electrode.

The second display pad electrode and the second touch pad electrode maybe located in the same layer as the first touch pattern and the secondtouch pattern.

The one or more insulation layers including the connection hole may belocated between the first touch pad electrode and the touch link wire,and the connection hole may be located above the first touch padelectrode and below the touch link wire.

The organic light-emitting display device may further include aconnection pad electrode located in the same layer as one layer of thelight-emitting elements between a first touch pad electrode and a secondtouch pad electrode of each touch pad.

Each light-emitting element may include an anode electrode connected toa corresponding one of the thin-film transistors, a cathode electrodedisposed to face the anode electrode, and at least one light-emittingstack disposed between the anode electrode and the cathode electrode andconfigured to generate white light, and the organic light-emittingdisplay device may further include a color filter disposed above one ofthe cathode electrode, the encapsulation layer, and the first and secondtouch electrodes.

In accordance with another aspect of the present disclosure, a method ofmanufacturing an organic light-emitting display device includes forminga plurality of thin-film transistors disposed in an active area of asubstrate, and forming a plurality of first display pad electrodes and aplurality of first touch pad electrodes parallel to the first displaypad electrodes on a same side of the substrate in a non-active arealocated outside the active area, forming light-emitting elementsconnected to the respective thin-film transistors in the active area ofthe substrate, forming an encapsulation layer to cover the thin-filmtransistors and the light-emitting elements, forming a touch electrodearray including a first touch electrode and a second touch electrodeintersecting each other in the active area above the encapsulationlayer, and forming second display pad electrodes and second touch padelectrodes connected respectively to the first display pad electrodesand the first touch pad electrodes in the non-active area, andconnecting the second display pad electrodes and the second touch padelectrodes to a flexible printed circuit board.

The step of forming the first display pad electrodes and the first touchpad electrodes, may comprise forming a plurality of display link wiresto connect the first display pad electrodes with the respectivethin-film transistors.

The step of forming the touch electrode array, the second display padelectrodes, and the second touch pad electrodes, may comprise forming aplurality of touch link wires to connect the first and second touchelectrodes with the respective second touch pad electrodes.

The forming the first and second touch electrodes may include forming aplurality of first bridges in the active area on the encapsulationlayer, forming a touch insulation layer including touch connection holescorresponding to opposite sides of each first bridge, and forming, onthe touch insulation layer, a plurality of first touch patterns, whichare connected at opposite sides thereof to neighboring first bridgesthrough the touch connection holes, a plurality of second touchpatterns, which are spaced apart from the first touch patterns and thetouch connection holes, and a plurality of second bridges, which arelocated in the same layer as the second touch patterns and are connectedto the second touch patterns.

The touch link wire may be formed in the same layer as the firstbridges.

The step of forming the touch link wire, may comprise forming the touchlink wire may so as to overlap each first touch pad electrode.

The method of manufacturing the organic light-emitting display devicemay further comprise electrically connecting the touch link wire to eachsecond touch pad electrode by irradiating a laser from a bottom side ofthe substrate to an overlapping portion of the touch link wire and thefirst touch pad electrode.

The step of forming the touch insulation layer, may comprise formingconnection holes to expose each first touch pad electrode and each firstdisplay pad electrode, respectively.

It is to be understood that both the foregoing general description andthe following detailed description of the present disclosure areexemplary and explanatory and are intended to provide furtherexplanation of the disclosure as claimed.

BRIEF DESCRIPTION OF THE DRAWINGS

The accompanying drawings, which are included to provide a furtherunderstanding of the disclosure and are incorporated in and constitute apart of this application, illustrate aspect(s) of the disclosure andtogether with the description serve to explain the principle of thedisclosure.

In the drawings:

FIG. 1 is a plan view illustrating an organic light-emitting displaydevice having a touchscreen according to the present disclosure;

FIG. 2 is a perspective view illustrating an active area of FIG. 1;

FIG. 3 is a cross-sectional view separately illustrating a portion ofthe active area and a pad unit in the organic light-emitting displaydevice having the touchscreen according to a first aspect of the presentdisclosure;

FIG. 4A is a plan view illustrating a first display pad electrode andthe state after the first touch pad electrode are formed in the organiclight-emitting display device having the touchscreen according to thepresent disclosure;

FIG. 4B is a plan view illustrating a second display pad electrode andthe state after the second touch pad electrode are formed in the organiclight-emitting display device having the touchscreen according to thepresent disclosure;

FIG. 5 is a cross-sectional view separately illustrating a portion ofthe active area and the pad unit in the organic light-emitting displaydevice having the touchscreen according to a second aspect of thepresent disclosure;

FIG. 6 is a cross-sectional view separately illustrating a portion ofthe active area and the pad unit in the organic light-emitting displaydevice having the touchscreen according to a third aspect of the presentdisclosure;

FIGS. 7A to 7E are process cross-sectional views illustrating a methodof manufacturing the organic light-emitting display device having thetouchscreen according to the first aspect of the present disclosure;

FIGS. 8A to 8D are process cross-sectional views illustrating a methodof manufacturing the organic light-emitting display device having thetouchscreen according to the second aspect of the present disclosure;

FIGS. 9A to 9G are process cross-sectional views illustrating a methodof manufacturing the organic light-emitting display device having thetouchscreen according to the third aspect of the present disclosure; and

FIG. 10 is a cross-sectional view illustrating the organiclight-emitting display device having the touchscreen according to afourth aspect of the present disclosure.

DETAILED DESCRIPTION

The advantages and features of the present disclosure and the way ofattaining them will become apparent with reference to aspects describedbelow in detail in conjunction with the accompanying drawings. Thepresent disclosure, however, is not limited to the aspects disclosedhereinafter and may be embodied in many different forms. Rather, theseexemplary aspects are provided so that this disclosure will be throughand complete and will fully convey the scope to those skilled in theart. Thus, the scope of the present disclosure should be defined by theclaims.

The shapes, sizes, ratios, angles, numbers, and the like, which areillustrated in the drawings in order to describe various aspects of thepresent disclosure, are merely given by way of example, and therefore,the present disclosure is not limited to the illustrations in thedrawings. The same or extremely similar elements are designated by thesame reference numerals throughout the specification. In addition, inthe description of the present disclosure, a detailed description ofrelated known technologies will be omitted when it may make the subjectmatter of the present disclosure rather unclear. In the presentspecification, when the terms “comprises”, “includes”, and the like areused, other elements may be added unless the term “only” is used. Anelement described in the singular form is intended to include aplurality of elements unless the context clearly indicates otherwise.

In the interpretation of constituent elements included in the variousaspects of the present disclosure, the constituent elements areinterpreted as including an error range even if there is no explicitdescription thereof.

In the description of the various aspects of the present disclosure,when describing positional relationships, for example, when thepositional relationship between two parts is described using “on”,“above”, “below”, “aside”, or the like, one or more other parts may belocated between the two parts unless the term “directly” or “closely” isused.

In the description of the various aspects of the present disclosure,when describing temporal relationships, for example, when the temporalrelationship between two actions is described using “after”,“subsequently”, “next”, “before”, or the like, the actions may not occurin succession unless the term “directly” or “just” is used.

In the description of the various aspects of the present disclosure,although terms such as, for example, “first” and “second” may be used todescribe various elements, these terms are merely used to distinguishthe same or similar elements from each other. Therefore, in the presentspecification, an element modified by “first” may be the same as anelement modified by “second” within the technical scope of the presentdisclosure unless otherwise mentioned.

The respective features of the various aspects of the present disclosuremay be partially or wholly coupled to and combined with each other, andvarious technical linkages and driving thereof are possible. Thesevarious aspects may be performed independently of each other, or may beperformed in association with each other.

Hereinafter, aspects related to an organic light-emitting display devicehaving a touchscreen and a method of manufacturing the same according tothe present disclosure will be described in detail with reference to theaccompanying drawings.

FIG. 1 is a plan view illustrating an organic light-emitting displaydevice having a touchscreen according to the present disclosure, andFIG. 2 is a perspective view illustrating an active area of FIG. 1. Inaddition, FIG. 3 is a cross-sectional view separately illustrating aportion of the active area and a pad unit in the organic light-emittingdisplay device having the touchscreen according to a first aspect of thepresent disclosure.

As illustrated in FIG. 1, the organic light-emitting display devicehaving the touchscreen according to the present disclosure includes atouch pad TP and a display pad DP provided on the same side of asubstrate 111, and a single flexible printed circuit board 1500 isconnected to both the touch pad TP and the display pad DP.

The substrate 111 is largely divided into a central active area AA (thearea inside a dotted line) and a non-active area outside thereof. Thesubstrate 111 is illustrated as having a rectangular shape, and theouter rim thereof is defined by four sides. A portion of the non-activearea (outside the active area AA), which corresponds to one of the foursides of the substrate 111, has a width larger than the remainingportion of the non-active area. A pad unit, which includes the touch padTP and the display pad DP, is provided in the larger-width portion ofthe non-active area, and the single flexible printed circuit board 1500is connected to the pad unit. In the organic light-emitting displaydevice having the touchscreen according to the present disclosure, inorder to connect the single flexible printed circuit board 1500 to boththe touch pad TP and the display pad DP, the touch pad TP and thedisplay pad DP are aligned on a single side.

Here, the shape of the substrate 111 is not limited to a rectangularshape, and may be modified to a polygonal shape or a circular shape. Theillustration is based on the form of a generally manufactured displaydevice. In the organic light-emitting display device having thetouchscreen according to the present disclosure, the flexible printedcircuit board 1500 is located on the same side as the pad unit,regardless of the shape of the substrate 111.

The substrate 111 may be one of a transparent glass substrate, atransparent plastic substrate, an opaque plastic substrate, and areflective metal substrate. In addition, the substrate 111 may beflexible by adjusting thickness or using a flexible material.

Each of the touch pad TP and the display pad DP is provided in a pluralnumber so as to correspond in number to, for example, the number oftouch electrodes 152 and 154 and the number of scan lines and datalines, which are provided on the substrate 111. Since the touch pad TPand the display pad DP are located on the same side of the substrate111, and moreover, when the touch pad TP and the display pad DP have amultilayer structure, at least one layer of the touch pad TP and atleast one layer of the display pad DP are located on the same plane, thetouch pad TP and the display pad DP are parallel to and spaced apartfrom each other so as not to overlap each other.

Referring to FIG. 2, in the active area of the substrate 111, subpixelsSP are arranged in a matrix form, and scan lines SL and data lines DLfor defining the respective subpixels SP are provided to intersect eachother. A pixel-driving circuit and a light-emitting element 120, whichis connected to a thin-film transistor of the pixel-driving circuit, areprovided at each intersection of the scan lines SL and the data linesDL.

Based on a layered configuration, the organic light-emitting displaydevice having the touchscreen according to the present disclosure, asillustrated in FIGS. 2 and 3, includes an encapsulation layer 140configured to cover the pixel-driving circuit, which includes the scanline SL and the data line DL, and the light-emitting element 120 in theactive area, and further includes first and second touch electrodes 152and 154 arranged to intersect each other on the encapsulation layer 140.

The organic light-emitting display device senses the presence or absenceof a touch and a touch position by sensing a variation in mutualcapacitance Cm in response to a user touch made by a finger or an objectsuch as a stylus via the first and second touch electrodes 152 and 154during a touch period.

Then, the organic light-emitting display device having the touchscreendisplays an image through unit pixels during a display period. Each unitpixel may include red (R), green (G), and blue (B) subpixels SP, or mayinclude red (R), green (G), blue (B), and white (W) subpixels SP, asillustrated. Alternatively, each unit pixel may be a combination ofdifferent colors of subpixels capable of displaying white.

The first and second touch electrodes 152 and 154 are disposed on thetop portion of the encapsulation layer 140, and generate the mutualcapacitance Cm at the neighboring portions thereof. In the organiclight-emitting display device of the present disclosure, the first andsecond touch electrodes 152 and 154 include no separate base material orsubstrate, and are successively disposed on the encapsulation layer 140without a separate adhesive layer therebetween. That is, when theencapsulation layer 140 covers the substrate 111 excluding the touch padTP and the display pad DP, the first and second touch electrodes 152 and154, which intersect each other, are formed on the encapsulation layer140 through continuous processes. The first and second touch electrodes152 and 154 serve to generate the mutual capacitance Cm for touchdetection.

Meanwhile, each of the subpixels SP includes the pixel-driving circuitand the light-emitting element 120 connected to the pixel-drivingcircuit, as illustrated in the lower end of FIG. 2. In some cases, thelight-emitting element 120 may be provided for each unit pixel includingR, G and B subpixels, or R, G, B and W subpixels.

The pixel-driving circuit includes a switching thin-film transistor T1,a driving thin-film transistor T2, and a storage capacitor Cst.

The switching thin-film transistor T1 is turned on when a scan pulse issupplied to the scan line SL, and supplies a data signal supplied to thedata line DL to the storage capacitor Cst and a gate electrode of thedriving thin-film transistor T2.

The driving thin-film transistor T2 controls current I to be suppliedfrom a high-voltage (VDD) supply line to the light-emitting element 120in response to the data signal supplied to the gate electrode of thedriving thin-film transistor T2, thereby adjusting the amount ofemission of light from the light-emitting element 120. Then, even if theswitching thin-film transistor T1 is turned off, the driving thin-filmtransistor T2 maintains the emission of light of the light-emittingelement 120 by supplying a constant amount of current I thereto by avoltage charged in the storage capacitor Cst until a data signal of anext frame is supplied.

The driving thin-film transistor T2 or 130, as illustrated in FIG. 3,includes a gate electrode 132, a semiconductor layer 134 overlapping thegate electrode 132 with a gate insulation layer 112 therebetween, andsource and drain electrodes 136 and 138 formed on an interlayerinsulation layer 114 so as to come into contact with the semiconductorlayer 134.

The light-emitting element 120 is disposed in the active area of thesubstrate 111, and includes an anode electrode 122, a light-emittingstack 124 formed on the anode electrode 122, and a cathode electrode 126formed on the light-emitting stack 124.

The anode electrode 122 is electrically connected to the drain electrode138 of the driving thin-film transistor 130, which is exposed through apixel connection hole 148 formed in a planarization layer 118. Thelight-emitting stack 124 is formed on the anode electrode 122 in anemission area defined by a bank 128. The light-emitting stack 124 isformed by stacking a hole transport layer, an organic emission layer,and an electron transport layer on the anode electrode 122 in this orderor in the reverse order. The cathode electrode 126 is formed so as toface the anode electrode 122 with the light-emitting stack 124therebetween.

The encapsulation layer 140 prevents external moisture or oxygen fromentering the light-emitting element 120. To this end, the encapsulationlayer 140 includes a plurality of inorganic encapsulation layers 142 and146 and an organic encapsulation layer 144 disposed between theinorganic encapsulation layers 142 and 146. The inorganic encapsulationlayer 146 is the uppermost layer. Here, the inorganic encapsulationlayers 142 and the organic encapsulation layer 144 of the encapsulationlayer 140 are alternately disposed, and the encapsulation layer 140includes at least two inorganic encapsulation layers 142 and 146 and atleast one organic encapsulation layer 144. In the present disclosure, asthe most basic structure, the structure of the encapsulation layer 140in which the organic encapsulation layer 144 is disposed between thefirst and second inorganic encapsulation layers 142 and 146 will bedescribed by way of example. In addition to the illustrated basicstructure, the encapsulation layer 140 may further include at least onepair unit including a pair comprising an inorganic encapsulation layerand an organic encapsulation layer.

The first inorganic encapsulation layer 142 is formed on the substrate111, on which the cathode electrode 126 has been formed, so as to beclosest to the light-emitting element 120. The first inorganicencapsulation layer 142 is formed of an inorganic insulation materialthat is capable of being deposited at a low temperature, such as siliconnitride (SiN_(x)), silicon oxide (SiO_(x)), silicon oxide nitride(SiON), and aluminum oxide (Al₂O₃). Thus, since the first inorganicencapsulation layer 142 is deposited under a low-temperature atmosphere,it is possible to prevent damage to the light-emitting stack 124, whichis vulnerable to a high-temperature atmosphere, during the depositionprocess of the first inorganic encapsulation layer 142.

The organic encapsulation layer 144 serves to dampen stress between therespective layers due to bending of the organic light-emitting displaydevice and to increase planarization performance. The organicencapsulation layer 144 is formed using an organic insulation material,such as an acryl resin, epoxy resin, polyimide, polyethylene, andsilicon oxycarbide (SiOC).

The second inorganic encapsulation layer 146 is formed on the substrate111, on which the organic encapsulation layer 144 has been formed, so asto cover the upper surface and the side surface of the organicencapsulation layer 144. Thus, the second inorganic capsulation layer146 minimizes or prevents external moisture or oxygen from entering theorganic encapsulation layer 144. The second inorganic encapsulationlayer 146 is formed of an inorganic insulation material, such as siliconnitride (SiN_(x)), silicon oxide (SiO_(x)), silicon oxide nitride(SiON), and aluminum oxide (Al₂O₃). The first and second inorganicencapsulation layers 142 and 146 may be formed of the same material, andmay each include a plurality of layers.

The total thickness of the encapsulation layer 140 may range from 10 μmto 30 μm, in order to sufficiently prevent the introduction of externalmoisture and to prevent movement of inner particles and the influence ofthe inner particles.

Meanwhile, the encapsulation layer 140 is configured to cover at leastthe active area, and a side portion thereof is located in the non-activearea. Here, note that the side portion of the encapsulation layer 140,which is exposed to the non-active area, is limited to an inorganicencapsulation layer, in order to effectively prevent the introduction ofoutside air. That is, the organic encapsulation layer 144 is locatedinside the inorganic encapsulation layers 142 and 146 thereabove andthereunder, and the second inorganic encapsulation layer 146 above theorganic encapsulation layer 144 is lengthened beyond the organicencapsulation layer 144 so as to cover both the top portion and the sideportion of the organic encapsulation layer 144 and to meet the sidesurface of the first inorganic encapsulation layer 142, which is alsolengthened beyond the organic encapsulation layer 144.

In FIG. 1, the portion indicated by “CA” is a portion in which theencapsulation layer 140 is disposed. In the illustrated example, theencapsulation layer 140 exposes a portion of the non-active area inwhich the touch pad TP and the display pad DP are provided, but coversthe active area AA and the remaining portion of the non-active area inwhich the touch pad TP and the display pad DP are not located. Thereason why the encapsulation layer 140 is also disposed in thenon-active area excluding the touch pad TP and the display pad DP is toprevent electrical interference and a short-circuit between a touch linkwire (reference numeral 156 shown in FIGS. 3 and 4B) and a display linkwire (reference numeral 137 shown in FIGS. 3 and 4A) because the displaylink wire 137, which is formed in a thin-film transistor formationprocess to connect each display pad DP to wires, such as the scan lineSL and the data line DL, located in the active area AA on the substrate111, is disposed in the non-active area, and because the touch link wire156 is formed to overlap the display link wire 137. That is, the touchlink wire 156 is disposed on the encapsulation layer 140, which coversthe display link wire 137.

As illustrated in FIGS. 2 and 3, the first touch electrode 152 and thesecond touch electrode 154 are disposed on the encapsulation layer 140.

Meanwhile, in FIG. 1, the portion indicated by “LB” is a portion of thenon-active area that is close to the touch pad TP and the display padDP. The display link wire 137 and the touch link wire 156 converge onthe display pad DP and the touch pad TP thereunder in the portion LB.

In the portion LB, the display pad DP includes a pad electrode layer,which is disposed in the same plane as the display link wire 137 on thesubstrate 111, so that the display link wire 137 is continuouslyconnected to the pad electrode layer in the same plane in the portionLB. The touch pad TP includes a lower pad electrode layer formed on thesubstrate 111. Since the touch link wire 156 is disposed on theencapsulation layer 140, the touch link wire 156 is electricallyconnected to a pattern extending from the lower pad electrode layer ofthe touch pad TP in the portion LB.

Hereinafter, the configuration of the touch pad TP and the display padDP, the configuration of the first and second touch electrodes 152 and154, and the configuration of the respective link wires will bedescribed based on the plan views.

FIG. 4A is a plan view illustrating a first display pad electrode andthe state after the first touch pad electrode are formed in the organiclight-emitting display device having the touchscreen according to thepresent disclosure, and FIG. 4B is a plan view illustrating a seconddisplay pad electrode and the state after the second touch pad electrodeare formed in the organic light-emitting display device having thetouchscreen according to the present disclosure.

As illustrated in FIG. 4A, in the organic light-emitting display devicehaving the touchscreen according to the present disclosure, a firsttouch pad electrode 168 of the touch pad TP and a first display padelectrode 182 of the display pad DP are formed through an array processof forming the scan line SL, the data line DL, the thin-film transistorsT1 and T2 (FIG. 2), and the storage capacitor Cst in the active area AA.In this process, as illustrated in the enlarged view in the lower endportion of FIG. 4A, the display link wire 137 is integrally continuouslyformed with the first display pad electrode 182 using a metal in thesame layer as the scan line SL or the data line DL. Meanwhile, thedisplay link wire 137 may be formed by laminating two or more layers, ormay be formed in different layers for respective regions, based on thelayered structure of the scan line SL, the data line, the power supplyvoltage line VDD or VSS, or the like, which are disposed in the activearea AA.

In contrast to this, the first touch pad electrode 168 of the touch padTP is formed to have an island shape in the same layer as the scan lineSL or the data line DL.

Here, as illustrated in FIG. 4A, the distance between a plurality offirst touch pad electrodes 168 may be greater than the distance betweena plurality of first display pad electrodes 182. This is because thenumber of scan lines SL and data lines DL disposed for each subpixel SP,in the active area AA is greater than the number of unit touch patterns(reference numerals 152 e and 154 e shown in FIG. 4B) of the first andsecond touch electrodes 152 and 154, which are required to sense atouch. Thus, the display pads DP are more densely arranged than thetouch pads TP. However, the present disclosure is not limited thereto,and the touch pads TP and the display pads DP may be disposed at thesame interval, or may be concentrated on a local portion (e.g., a centerportion of one side of the substrate 111).

As illustrated in FIG. 4A, after a plurality of subpixels, eachincluding a pixel-driving circuit, such as thin-film transistors andscan and data lines intersecting each other, as well as the firstdisplay pad electrode 182, the first touch pad electrode 168, and thedisplay link wire 137 are formed on the substrate 111, thelight-emitting element 120 (shown in FIG. 3) connected to thepixel-driving circuit is formed, and then the encapsulation layer 140 isformed to cover the aforementioned elements. At this time, a portion inwhich the touch pad TP and the display pad DP are provided is exposedfrom the encapsulation layer 140.

Subsequently, as illustrated in FIG. 4B, the first and second touchelectrodes 152 and 154 are formed on the encapsulation layer 140.

The first and second touch electrodes 152 and 154 are arranged so as tointersect each other, one of the first and second touch electrodes 152and 154 functioning as a touch-driving line, and the other onefunctioning as a touch-sensing line.

The first touch electrode 152 includes a plurality of first touchpatterns 152 e arranged in the Y-direction, and a first bridge 152 b,which integrally interconnects the neighboring first touch patterns 152e. The second touch electrode 154 includes a plurality of second touchpatterns 154 e arranged in the X-direction, and a second bridge 154 b,which is located in a layer different from the second touch patterns 154e and electrically interconnects neighboring second touch patterns 154e.

The first touch patterns 152 e and the second touch patterns 154 e arein the same layer. A touch insulation layer 158 is interposed betweenthe second bridge 154 b and the first and second touch patterns 152 eand 154 e.

The second bridge 154 b is located in a layer different from the firstand second touch patterns 152 e and 154 e with the touch insulationlayer 158 (shown in FIG. 3) interposed therebetween at the intersectionof the first and second touch electrodes 152 and 154, and is connectedto the neighboring second touch patterns 154 e through touch connectionholes 150 formed in the touch insulation layer 158.

The first bridge 152 b may be integrated with the neighboring firsttouch patterns 152 e. FIG. 4B shows that the first bridge pattern 152 band the first touch pattern 152 e are the same layer, and the secondbride pattern 154 b and the second touch pattern 154 e are differentlayers. But a structure of the touch electrode array is not limited toFIG. 4B, it is possible that the first bridge pattern 152 b and thefirst touch pattern 152 e are different layers, and the second bridepattern 154 b and the second touch pattern 154 e are the same layer.

Here, each touch pad TP may include touch pad electrodes in multiplelayers, and the touch link wire 156 may be formed simultaneously withthe formation of the first and second touch electrodes 152 and 154, andmay be located in the same layer as the second bridge 154 b, asillustrated in FIG. 3. The touch link wire 156 may be lengthened to thetouch pad TP so as to form a first connection pad electrode 172, whichis superimposed on the first touch pad electrode 168. Here, the touchlink wire 156 and the first connection pad electrode 172 are integratedwith each other, and are formed together with the second bridge 154 b ofa touch electrode array. In the same layer as the first connection padelectrode 172, a second connection pad electrode 184 of the display padDP, which has an island shape, may be formed so as to be superimposed onthe first display pad electrode 182. The second connection pad electrode184 may be omitted in some cases.

At the uppermost side of the touch pad TP or 170 and the display pad DPor 180, a second touch pad electrode 174 and a second display padelectrode 186 are located in the same layer as the first and secondtouch patterns 152 e and 154, which are formed of a transparentconductive layer. As such, the touch pad TP or 170 includes the firsttouch pad electrode 168, the first connection pad electrode 172lengthened from the touch link wire 156, and the second touch padelectrode 174, which are connected to each other in different layers.The display pad DP or 180 includes the first display pad electrode 182in the same layer as the display link wire 137, the second connectionpad electrode 184, and the second display pad electrode 186, which areconnected to each other in different layers. Here, a portion of thetouch pad TP or 170 for electrical connection of metals in differentlayers is referred to as a touch pad connector TPC, and a portion of thedisplay pad DP or 180 for electrical connection of metals in differentlayers is referred to as a display pad connector DPC. The touch padconnector TPC and the display pad connector DPC respectively correspondto reference numerals 178 a and 190 in the cross-sectional view of FIG.3.

The structure of FIG. 4B illustrates an example in which the secondtouch electrode 154, which is horizontally disposed, includes the secondtouch patterns 154 e and the second bridge 154 b, which are disposed indifferent layers, but a structure in which the first touch electrode152, which is vertically disposed, includes the first touch patterns 152e and the first bridge 152 b, which are disposed in different layers,may be applied to the present disclosure.

In addition, in the structure of the first and second touch electrodes152 and 154 illustrated in FIG. 3, the second bridge 154 b is disposedbelow the first and second touch patterns 152 e and 154 e, but thepresent disclosure is not limited thereto, and a structure in which thesecond bridge 154 is disposed above the first and second touch patterns152 e and 154 e may also be applied to the present disclosure.

The first and second touch patterns 152 e and 154 e are not limited to asingle layer as illustrated. In some cases, in order to prevent RC delayand to increase touch sensitivity, a metal mesh pattern may be laminatedon a touch pattern, which has a polygonal shape and a predeterminedsurface area, and is formed of a transparent electrode. In this case,the mesh pattern may be in contact with the top or bottom of the touchpattern formed of a transparent electrode, and in some cases, meshpatterns may be disposed respectively above and below the touch patternformed of a transparent electrode. Alternatively, a touch pattern may beformed by laminating transparent electrodes having a predetermined areaabove and below a mesh pattern.

Here, the mesh pattern may be formed of at least one of Al, Ti, Cu, orMo, or an alloy containing any one of them, and the transparentelectrode may be formed of a transparent conductive layer such as indiumtin oxide (ITO) and indium zinc oxide (IZO). In the case where the meshpattern has a very small line width, even when the mesh pattern islocated on the transparent electrode, it is possible to preventdeterioration in an aperture ratio or in transmissivity.

Meanwhile, the touch link wire 156 may be formed in the same layer asthe second bridge 154 b, which is formed of a metal in a layer differentfrom the first and second touch patterns 152 e and 154 e. Alternatively,when a mesh pattern is provided, the touch link wire 156 may be providedin the same layer as the mesh pattern.

Considering in detail with reference to FIG. 3 the configuration of thecompleted touch pad TP after the first and second touch electrodes 152and 154 are formed, it can be seen that the touch pad TP includes thefirst touch pad electrode 168 formed as a lowermost layer through anarray process, and the second touch pad electrode 174 formed as anuppermost layer through the same process as the first and second touchpatterns 152 e and 154 e. In the illustrated example, the touch linkwire 156 is lengthened to the touch pad side so as to form the firstconnection pad electrode 172, which is connected at the upper and lowersides thereof to the first and second touch pad electrodes 168 and 174.

However, the connection pad electrode 172 may be selectively provided inthe touch pad TP, and may be formed of a metal in a layer different fromthe touch link wire 156.

In addition, in the example illustrated in FIG. 3, to realize connectionof the touch link wire 156 and the touch pad 170, the touch link wire156 is lengthened to the touch pad 170 so that the first connection padelectrode 172 is formed in the same layer as the touch link wire 156using a metal of the touch link wire 156. However, the touch link wire156 needs not be used to form the first connection pad electrode 172 aslong as the touch link wire 156 and the touch pad 170 are electricallyconnected to each other at some other position. In one example, one ofthe first touch pad electrode 168 and the second touch pad electrode174, which constitute the touch pad 170, may be lengthened to theportion LB so as to overlap the touch link wire 156, and a connectionhole may be formed at the overlapping position to enable the connectionof the touch pad 170 and the touch link wire 156.

A specific connection method will be described below for each aspect.

In the same manner as the touch pad TP or 170, the layered structure ofthe display pad DP or 180 includes the first display pad electrode 182in the same layer as the source and drain electrodes 136 and 138, thesecond connection pad electrode 184 in the same layer as the touch linkwire 156, and the second display pad electrode 186 in the same layer asthe first and second touch patterns 152 e and 154 e, which aresequentially laminated from the bottom thereof.

Thus, except that the touch pad TP or 170 includes the first connectionpad electrode 172 integrated with the touch link wire 156, the touch padTP or 170 and the display pad DP or 180 have the same layered structure,and therefore, may be connected to the single flexible printed circuitboard 1500 located on the same side via an anisotropic conductive film1600 without a difference in height between the touch pad TP or 170 andthe display pad DP or 180 and the flexible printed circuit board 1500.Here, the flexible printed circuit board 1500 includes bump electrodes1510 and 1520 respectively corresponding to the touch pad TP or 170 andthe display pad DP or 180, and the bump electrodes 1510 and 1520 may beconnected to a drive IC (not illustrated) or a control chip (notillustrated), which is provided in the flexible printed circuit board1500, so as to receive an electrical signal therefrom. In addition, theanisotropic conductive film 1600 includes conductive balls 1610 mixed inan adhesive layer 1620. After the flexible printed circuit board 1500 ispositioned on one side of the substrate 111 on which the display pad DPor 180 and the touch pad TP or 170 are disposed, when a predeterminedpressure is applied to the anisotropic conductive film 1600 uponbonding, the inner conductive balls 1610 are broken, and the bumpelectrode 1510 or 1520 is electrically connected to the touch pad TP or170 or the display pad DP or 180.

Meanwhile, in the organic light-emitting display device having thetouchscreen according to the present disclosure, the touch pad 170 or TPand the display pad 180 or DP are aligned on the same side of thesubstrate 111, so that a region required for electrical connection ofthe substrate 111 and the flexible printed circuit board 1500 forreceiving a signal is limited to one side of the substrate 111. Thus,since a region required for bonding between the flexible printed circuitboard 1500 and the substrate 111 is limited to one side of the substrate111, when the adhesive layer 1620 of the anisotropic conductive film1600 is pushed and thus spreads by the pressure during bonding, theflexible printed circuit board 1500 is spaced apart from only one sideof the active area AA of the substrate 111, which may simplify thephysical configuration of a circuit unit on the substrate 111. Thus, aform factor may be improved. As a known flexible organic light-emittingdisplay device in which a touchscreen is attached to an organiclight-emitting panel, the touchscreen requires a touch pad, separatelyfrom a display pad for a light-emitting element or a thin-filmtransistor. Since the touch pad is located in a different plane from thedisplay pad, additional connection of the display pad and a printedcircuit board for the touchscreen has been require. However, the organiclight-emitting display device having the touchscreen according to thepresent disclosure may unify such double printed circuit boards.

The mutual capacitance array Cm is formed at the neighboring portions ofthe first and second touch electrodes 152 and 154. Thus, the mutualcapacitance array Cm serves as a touchscreen by storing charges inresponse to a touch driving pulse supplied to the first touch electrode152 or the second touch electrode 154, which functions as atouch-driving line, and discharging the stored charge to the secondtouch electrode 154 or the first touch electrode 152, which functions asa touch-sensing line.

Meanwhile, the touch link wire 156 transmits a touch driving pulse,which is generated in a touch drive unit provided in the flexibleprinted circuit board 1500, to one of the first touch electrode 152 andthe second touch electrode 154 via the touch pad 170, and transmits atouch signal generated from the other one to the touch pad 170. Thetouch link wire 156 is disposed between the touch pad 170 and the edgeof each of the first and second touch electrodes 152 and 154 in theactive area AA. When the touch link wire 156 is integrally formed withthe bridge electrode or the first and second touch patterns, the touchlink wire 156 is electrically connected to each of the first and secondtouch electrodes 152 and 154 without a separate connection hole.

The touch link wire 156 is formed in a single layer or in multiplelayers using a highly conductive material having strong corrosionresistance and acid resistance, such as Al, Ti, Cu, or Mo. For example,the touch link wire 156 may be formed in a triple-layered structure as astack of Ti/Al/Ti or Mo/Al/Mo, or may have a multilayer structureincluding a transparent conductive layer having strong corrosionresistance and acid resistance, such as ITO and IZO, and a highlyconductive opaque conductive layer such as Ti/Al/Ti and Mo/Al/Mo.

Meanwhile, after the formation of the first and second touch electrodes152 and 154, the touch link wire 156, the second touch pad electrode174, and the second display pad electrode 186 described above, a touchbarrier film may further be provided in a portion excluding the padunit, in order to protect the surfaces of the first and second touchelectrodes 152 and 154 and the touch link wire 156. The touch barrierfilm may be disposed in the portion CA of FIG. 1. The touch barrier filmreinforces the function of the encapsulation layer 140, in addition tothe first and second touch electrodes 152 and 154 and the touch linkwire 156, thereby further preventing the light-emitting element 120 frombeing damaged by external moisture or the like. The touch barrier filmis formed by applying an inorganic insulation layer onto an organicinsulation film. An optical film (not illustrated), such as a circularpolarizer or an OLED transmittance controllable film (OTF), may bedisposed on the touch barrier film.

Hereinafter, other aspects of the present disclosure will be described.The following aspects are the same as the above-described first aspectin that the flexible printed circuit board 1500 is provided on the sameside of the substrate 111 as the pad unit, but adopt modifiedconfigurations of the pad unit.

These aspects differ from each other in terms of the position of aconnector of the touch link wire and the touch pad, but are the same inthat the touch pad and the display pad have a layered structure of twoor more layers.

Thus, the configuration of the active area, which has the same structureas that in the organic light-emitting display device having thetouchscreen according to the above-described first aspect, will beomitted for convenience of description, and the following description ismainly based on the pad unit, which differs from that in the firstaspect.

FIG. 5 is a cross-sectional view separately illustrating a portion ofthe active area and the pad unit in the organic light-emitting displaydevice having the touchscreen according to a second aspect of thepresent disclosure.

As illustrated in FIG. 5, in the organic light-emitting display devicehaving the touchscreen according to the second aspect of the presentdisclosure, the touch pad 170 and the display pad 180 have the sametriple-layered structure, but each of first and second connection padelectrodes 222 and 224 is formed of the same layer as the anodeelectrode 122 of the light-emitting element 120, unlike the firstaspect.

That is, the touch pad 170 includes the first touch pad electrode 160,which is in the same layer as the data line DL and the source and drainelectrodes 136 and 138, the first connection pad electrode 222, which isin the same layer as the anode electrode 122, and the second touch padelectrode 174, which is in the same layer as the first and secondtransparent touch patterns 152 e (or 152 b) and 154 e, which aresequentially laminated from the bottom. The display pad 180 includes thefirst display pad electrode 182, which is in the same layer as the dataline DL and the source and drain electrodes 136 and 138, the secondconnection pad electrode 224, which is in the same layer as the anodeelectrode 122, and the second display pad electrode 186, which is in thesame layer as the first and second touch patterns 152 (or 152 b) and 154e, which are laminated in sequence from the bottom side. The touch pad170 and the display pad 180 have the same layered structure.

The first connection pad electrode 222 is lengthened from the touch pad170 into the touch insulation layer 158 for electrical connection withthe touch link wire 156, and is electrically connected to the touch linkwire 156 at a position at which it overlaps the touch link wire 156. Theportion indicated by “RTC” is a portion in which the touch link wire 156and the first connection pad electrode 222 are electrically connected toeach other.

In this case, a flexible printed circuit board (not illustrated) may beconnected to the touch pad 170 and the display pad 180, which arelocated in the same layer on the same side of the substrate 111, withouta difference in height therebetween.

In some cases, the second connection pad electrode 224 of the displaypad 180 may be omitted. In this case, since the second connection padelectrode 224 may have a thickness of approximately 1 μm or less, moreparticularly, a thickness of 5000 Å or less, even when the secondconnection pad electrode 224 is omitted, the display pad 180 may nothave a large difference in height from the neighboring touch pad 170.Thus, even when all of the flexible printed circuit board, the touch pad170, and the display pad 180 are bonded to each other, bondingreliability may be maintained.

When the first connection pad electrode 222 is omitted together with thesecond connection pad electrode 224, in a process of patterning thetouch insulation layer 158, after a connection hole is formed to exposeone side of the touch link wire 156, the second touch pad electrode 174is lengthened so as to be connected to the exposed touch link wire 156,so that the touch link wire 156 and the touch pad TP may be connected toeach other.

FIG. 6 is a cross-sectional view separately illustrating a portion ofthe active area and the pad unit in the organic light-emitting displaydevice having the touchscreen according to a third aspect of the presentdisclosure.

As illustrated in FIG. 6, as compared with the second aspect, in theorganic light-emitting display device having the touchscreen accordingto the third aspect of the present disclosure, the first touch padelectrode 168 is lengthened from the touch pad 170 so as to overlap thetouch link wire 156, and an overlapping portion of the first touch padelectrode 168 and the touch link wire 156 is subjected to laser weldingin order to melt a metal material of the welding portion, so that anelectrical connector RTC of the first touch pad electrode 168 and thetouch link wire 156 is formed. Here, the portion indicated by referencenumeral 168 a has the same material as that of the first touch padelectrode 168. In this case, the substrate 111 may be formed of atransparent material that is stable for laser irradiation and ispermeable. The protective layer 116 between the touch link wire 156 andthe first touch pad electrode 168 may be an inorganic layer that has asmall thickness suitable for selective burning using laser irradiationenergy. Here, the electrical connector RTC between the touch link wire156 and the first touch pad electrode 168 is located in the protectivelayer 116 between the first touch pad electrode 168 and the touch linkwire 156, and is located above the first touch pad electrode 168 andbelow the touch link wire 156.

Meanwhile, a method of forming the electrical connector RTC between thetouch link wire 156 and the first touch pad electrode 168 is not limitedto laser welding. In the case in which there is an additional process offorming an insulation layer and a hole therein after the encapsulationlayer 140 is formed and before the touch link wire 156 is formed, theelectrical connector RTC may be patterned by a photolithography methodin the corresponding process.

Note that a portion in which the electrical connector is formed islimited to a portion in which the first touch pad electrode 168 does notoverlap the display link wire 137.

Here, first and second connection pad electrodes 322 and 324 may beomitted from each of the touch pad 170 and the display pad 180. In thecase of omission thereof, the second touch pad electrode 174 and thesecond display pad electrode 186 may be directly connected to each ofthe first touch pad electrode 168 and the second display pad electrode182 thereunder.

In some cases, the electrical connector RTC between the touch link wire156 and the touch pad 170 may be provided in the touch link wire 156. Insuch cases, the second touch pad electrode 174 may be lengthened to thetouch link wire 156 and a connection hole may be formed in anoverlapping portion of the second touch pad electrode 174 and the touchlink wire 156 in the touch insulation layer 158, so that the electricalconnector RTC may be formed through the connection hole.

Hereinafter, a method of manufacturing the organic light-emittingdisplay device having the touchscreen according to the presentdisclosure will be described for each aspect.

*Manufacturing Method of First Aspect*

FIGS. 7A to 7E are process cross-sectional views illustrating a methodof manufacturing the organic light-emitting display device having thetouchscreen according to the first aspect of the present disclosure.

As illustrated in FIG. 7A, the switching thin-film transistor (see T1 inthe pixel-driving circuit of FIG. 2) and the driving thin-filmtransistor T2 or 130 are formed in each subpixel of the substrate 111.

Specifically, by selectively patterning a metal material, the scan lineSL is formed in the first direction on the active area of the substrate111, and the gate electrode 132 is formed for each subpixel SP so as tobe connected to the scan line SL or to have an island shape.

Subsequently, the gate insulation layer 112 is formed so as to cover thegate electrode 132, and the semiconductor layer 134 is formed on thegate insulation layer 112 so as to overlap the gate electrode 132. Then,the interlayer insulation layer 114 is formed over the entire surfacethereof.

Subsequently, the interlayer insulation layer 114 is selectively removedto expose opposite ends of the semiconductor layer 134.

Subsequently, by selectively patterning a metal material, the data lineDL is formed in a direction intersecting the scan line SL, and thesource and drain electrodes 136 and 138 are formed so as to be connectedto opposite ends of the semiconductor layer 134. In the same process,the first touch pad electrode 168 and the first display pad electrode182 are formed in the non-active area that corresponds to one side ofthe substrate 111. In the same process, as illustrated in FIG. 4A, thedisplay link wire 137 is formed so as to extend from the data line DL orthe scan line SL. When the display link wire 137 is formed so as toextend from the scan line SL, the first display pad electrode 182 andthe display link wire 137 may be located in the same layer as the gateelectrode 132.

Subsequently, as illustrated in FIG. 7B, the protective layer 116 formedof an inorganic layer is formed over the entire surface thereof.

Subsequently, the planarization layer 118 is formed using an organiclayer such as photo-acryl, so as to cover the first touch pad electrode168, the first display pad electrode 182, the switching thin-filmtransistor, and the driving thin-film transistor T2 or 130, in order toplanarize the structure thereunder and to allow the light-emittingelement to be formed on the flat top surface thereof. At this time, theplanarization layer 118 is removed in the non-active area in order toprevent separation of, for example, the pad unit due to theplanarization layer during a bonding process or a repair process.

Subsequently, the planarization layer 118 and the protective layer 116are selectively removed to form the pixel connection hole 148, whichexposes the drain electrode 138. In this process, the planarizationlayer may be removed from the pad unit. At this time, the first touchpad connection hole 178 a and the first display pad connection hole 190are formed in the pad unit.

Subsequently, the anode electrode 122, the bank 128, the light-emittingstack 124, and the cathode electrode 126 are sequentially formed on theplanarization layer 118. Here, the anode electrode 122, thelight-emitting stack 124, and the cathode electrode 126 function as thelight-emitting element 120.

The encapsulation layer 140 is formed by alternately laminating theinorganic encapsulation layers 142 and 146 and the organic encapsulationlayer 144 on the substrate 111, on which the cathode electrode 126 hasbeen formed. Here, in order to sufficiently cover the light-emittingelement 120 thereunder, the encapsulation layer 140 covers the entireactive area AA, and is lengthened to the non-active area excluding thepad unit so as to cover the display link wire 137, which is formed inadvance (see FIG. 4B).

Subsequently, the second bridge 154 b is formed in a single layer or inmultiple layers using a metal having strong corrosion resistance andacid resistance, such as Al, Ti, Cu, or Mo, on the uppermost inorganicencapsulation layer 146 of the encapsulation layer 140 to have an islandshape, and simultaneously, the touch link wire 156 is formed in thenon-active area. The touch link wire 156 is lengthened to the touch pad170 located outside the encapsulation layer 140 so as to form the firstconnection pad electrode 172, which overlaps the first touch padelectrode 168 and is connected thereto through the first touch padconnection hole 178 a. Then, the second connection pad electrode 184 isformed so as to be spaced apart from the first connection pad electrode172 and to be connected to the first display pad electrode 182 throughthe first display pad connection hole 190.

Specifically, after a first conductive layer is deposited over theentire surface of the substrate 111, on which the encapsulation layer140 has been formed, through a deposition process using sputtering atroom temperature, the first conductive layer is patterned through aphotolithography process and an etching process, so that the touch linkwire 156, the first connection pad electrode 172, and the secondconnection pad electrode 184 are formed. Here, the first conductivelayer is formed in a single layer or in multiple layers using a metalhaving strong corrosion resistance and acid resistance, such as Al, Ti,Cu, or Mo. For example, the first conductive layer may be atriple-layered structure as a stack of Ti/Al/Ti or Mo/Al/Mo.

Since the second connection pad electrode 184 prevents the first displaypad electrode 182 from being exposed, and the first connection padelectrode 172 prevents the first touch pad electrode 168 from beingexposed, it is possible to prevent the first touch pad electrode 168 andthe first display pad electrode 182 from being damaged by an etchingsolution, which is added in a subsequent process of forming the firstand second touch patterns 152 e and 154 e or the first bridge 152 b.However, since the protection of the first touch pad electrode 168 andthe first display pad electrode 182 is adjustable based on the selectedtype of etching solution or the etching rate in the subsequent etchingprocess, the first and second connection pad electrodes 172 and 184 maynot be provided, and may be replaced with the anode electrode 122 or thecathode electrode 126 of the light-emitting element 120. However, in thefirst aspect of the present disclosure, the first connection padelectrode 172 is integrally formed with the touch link wire 156, and itis meaningful to connect the first touch pad electrode 168 to the touchlink wire 156 on the encapsulation layer 140, which are formed indifferent processes.

Subsequently, as illustrated in FIG. 7C, the touch insulation layer 158is deposited to have a thickness ranging from 500 Å to 5 μm through adeposition or coating process over the entire surface including thesecond bridge 154 b, the touch link wire 156, and the first and secondconnection pad electrodes 172 and 184. Then, to expose opposite ends ofthe top portion of the second bridge 154 b and the top portion of thefirst and second connection pad electrodes 172 and 184, the touchconnection holes 150, the second touch pad connection hole 178 b, andthe second display pad connection hole 192 are formed.

Here, the touch insulation layer 158 may be an organic layer or aninorganic layer, which may be formed through a low-temperature process.When the touch insulation layer 158 is formed of an organic layer, thetouch insulation layer 158 is formed by coating the substrate with anorganic layer, and thereafter curing the organic layer at a temperatureof 100° C. or less in order to prevent damage to the light-emittingstack 124, which is vulnerable to a high temperature. When the touchinsulation layer 158 is formed of an inorganic layer, the touchinsulation layer 158 having a multilayer structure is formed byperforming a low-temperature CVD deposition process and a cleaningprocess at least two times in order to prevent damage to thelight-emitting stack 124, which is vulnerable to a high temperature.Subsequently, by patterning the touch insulation layer 158 through aphotolithography process and an etching process, the touch connectionholes 150, the second touch pad connection hole 178 b, and the seconddisplay pad connection hole 192 are provided. Here, the first touch padconnection hole 178 a and the second touch pad connection hole 178 b areat substantially the same position, and the first display pad connectionhole 190 and the second display pad connection hole 192 are atsubstantially the same position. As such, the second touch padconnection hole 178 b and the second display pad connection hole 192 arelocated respectively above the first touch pad connection hole 178 a andthe first display pad connection hole 190.

Subsequently, as illustrated in FIG. 7D, by depositing a secondconductive layer on the touch insulation layer 158 including the touchconnection holes 150, the second touch pad connection hole 178 b, andthe second display pad connection hole 192, and then selectivelyremoving the same, in the active area, each second touch pattern 154 e,which is connected to the second bridge 154 b through the touchconnection hole 150, each first touch pattern (see 152 e of FIG. 4B),which is spaced apart from the second touch pattern 154 e and isarranged in a direction intersecting the second touch pattern 154 e, andthe first bridge 152 b, which integrally interconnects neighboring firsttouch patterns 152 e, are formed. In addition, the second touch padelectrode 174, which is connected to the first connection pad electrode172 thereunder through the second touch pad connection hole 178 b, andthe second display pad electrode 186, which is connected to the secondconnection pad electrode 184 thereunder through the second display padconnection hole 192, are formed.

Here, the second conductive layer may be formed using a transparentconductive layer, such as ITO or IZO, or a metal having strong corrosionresistance and acid resistance, such as Al, Ti, Cu, and Mo, or may beformed by laminating the aforementioned conductive layer or metal in twoor more layers. The second conductive layer is formed by a depositionmethod such as sputtering at room temperature. In this case, since thesecond touch pad electrode 174 and the second display pad electrode 186,which form uppermost electrodes of the touch pad TP and the display padDP, are formed using the second conductive layer, in order to preventsurface corrosion and achieve stability, the second conductive layer mayinclude a single transparent conductive layer such as ITO and IZO, ormay include an upper transparent conductive layer, such as ITO and IZO,when it is formed in multiple layers.

Through the process described above, the touch pad TP or 170 has atriple-layered structure including the first touch pad electrode 168,the first connection pad electrode 172, and the second touch padelectrode 174, which are sequentially laminated from the bottom, and thedisplay pad DP or 180 has a triple-layered structure including thesecond display pad electrode 182, the second connection pad electrode184, and the second display pad electrode 186, which are sequentiallylaminated from the bottom and are respectively formed in the same layersas those of the touch pad TP or 180.

Subsequently, as illustrated in FIG. 7E, in order to apply an electricalsignal to the scan line SL, the data line DL, and the first and secondtouch electrodes 152 and 154, the printed circuit board 1500, whichincludes a drive IC and a touch controller therein, is provided. At thistime, the printed circuit board 1500 includes the bump electrodes 1510and 1520 at positions corresponding to the touch pad TP or 170 and thedisplay pad DP or 180. The anisotropic conductive film 1600 isinterposed between the printed circuit board 1500 and the pad unit PTand DP of the substrate 111 to achieve electrical connection whenpressure is applied to the back side of the flexible printed circuitboard 1500.

Here, in the anisotropic conductive film 1600, the conductive balls 1610are mixed in the adhesive layer 1620. When pressure is applied thereto,the conductive balls 1610 are broken so as to achieve electricalconnection between the bump electrode 1510 or 1520 and the touch pad 170or the display pad 180 located thereabove and thereunder.

In this way, in the organic light-emitting display device having thetouchscreen according to the first aspect of the present disclosure,before the encapsulation layer 140 is formed, the first touch padelectrode 168 having an island shape and the first display pad electrode182 connected to the display link wire 137 are provided. Then, after theencapsulation layer 140 is formed, in the process of forming the firstand second touch electrodes, the second touch pad electrode 174 and thesecond display pad electrode 186 are formed so as to be respectivelyconnected to the first touch pad electrode 168 and the touch link wire156. Thereby, by applying the same pad structure to different types ofpads TP and DP, the pads TP and DP may be connected to the flexibleprinted circuit board 1500 without a difference in height therebetween.

In addition, in the organic light-emitting display device having thetouchscreen according to the present disclosure, since the encapsulationlayer 140 is located between the display link wire 137, which is used tointerconnect the display pad DP, the thin-film transistor, the scan lineSL, and the data line DL, and the touch link wire 156, whichinterconnects the touch pad TP and the first and second touch electrodes152 and 154, electrical interference between the link wires 137 and 156may be prevented, so that the thin-film transistor, the light-emittingelement 120, and the first and second touch electrodes 152 and 154 maybe driven without interference therebetween even if they overlap eachother when viewed in plan.

In addition, the touch link wire 156 is lengthened to the touch pad soas to form a pad electrode, thereby not only functioning as an auxiliarypad electrode but also electrically connecting the first and secondtouch electrodes 152 and 154, which are formed in a touch electrodearray formation process, to the first touch pad electrode 168, which isformed in a different array process.

The manufacturing methods of the following aspects will be describedonly based on differences from the manufacturing method of the firstaspect, and a description of the same parts will be omitted.

*Manufacturing Method of Second Aspect*

FIGS. 8A to 8D are process cross-sectional views illustrating a methodof manufacturing the organic light-emitting display device having thetouchscreen according to the second aspect of the present disclosure.

As illustrated in FIG. 8A, in a method of manufacturing the organiclight-emitting display device having the touchscreen according to thesecond aspect of the present disclosure, first, the switching thin-filmtransistor (shown as T1 in the pixel-driving circuit of FIG. 2) and thedriving thin-film transistor T2 or 130 are formed in each subpixel SP ofthe substrate 111. In this process, the first touch pad electrode 168and the first display pad electrode 182, which are spaced apart fromeach other, are formed in the same layer as the source and drainelectrodes 136 and 138 and the data line (shown as DL of FIG. 4A).

Subsequently, the protective layer 116 is formed using an inorganiclayer over the entire surface thereof.

Subsequently, the planarization layer 118 is formed using an organiclayer such as photo-acryl, so as to cover the first touch pad electrode168, the first display pad electrode 182, the switching thin-filmtransistor, and the driving thin-film transistor T2 or 130, in order toplanarize the structure thereunder and to form the light-emittingelement on the top flat surface thereof. At this time, the planarizationlayer 118 is removed in the non-active area in order to preventseparation of, for example, the pad unit due to the planarization layerduring a bonding process or a repair process.

Subsequently, the planarization layer 118 and the protective layer 116are selectively removed to form the pixel connection hole 148, whichexposes the drain electrode 138. In this process, the first touch padconnection hole 178 a and the first display pad connection hole 190 areformed in the pad unit.

Subsequently, as illustrated in FIG. 8B, by depositing a firstconductive layer, which is a reflective electrode, a transparentelectrode, or a lamination thereof, on the planarization layer 118 andthe pad unit from which the planarization layer 118 has been removed,and selectively removing the same, the anode electrode 122 is formed foreach subpixel SP, the first connection pad electrode 222 is formed so asto be connected to the first touch pad electrode 168 through the firsttouch pad connection hole 178 a, and the second connection pad electrode224 is formed so as to be connected to the first display pad electrode182 through the first display pad connection hole 190.

Subsequently, the bank 128, a portion of which overlaps the anodeelectrode 122 to define an emission area, is formed, and thelight-emitting stack 124 including the emission layer and the cathodeelectrode 126 are sequentially formed. Here, the anode electrode 122,the light-emitting stack 124, and the cathode electrode 126 function asthe light-emitting element 120.

The encapsulation layer 140 is formed by alternately laminating theinorganic encapsulation layers 142 and 146 and the organic encapsulationlayer 144 on the substrate 111, on which the cathode electrode 126 hasbeen formed. Here, in order to sufficiently cover the light-emittingelement 120 thereunder, the encapsulation layer 140 covers the entireactive area AA, and is lengthened to the non-active area excluding thepad unit so as to cover the display link wire 137, which is formed inadvance (shown in FIG. 4B).

Subsequently, as illustrated in FIG. 8C, the second bridge 154 b isformed in a single layer or in multiple layers to have an island shapeby using a metal having strong corrosion resistance and acid resistance,such as Al, Ti, Cu, or Mo, on the uppermost inorganic encapsulationlayer 146 of the encapsulation layer 140, and simultaneously, the touchlink wire 156 is formed in the non-active area. At this time, the touchlink wire 156, which extends along the sidewall of the encapsulationlayer 140 and enters the non-active area, overlaps one side of the firstconnection pad electrode 222 and is electrically connected thereto.

Subsequently, as illustrated in FIG. 8D, the touch insulation layer 158is deposited to have a thickness ranging from 500 Å to 5 μm through adeposition or coating process over the entire surface including thesecond bridge 154 b, the touch link wire 156, and the first and secondconnection pad electrodes 222 and 224. Then, to expose opposite ends ofthe second bridge 154 b and the top portion of the first and secondconnection pad electrodes 222 and 224, the touch connection holes 150,and connection holes at the same positions as the first touch padconnection hole 178 a and the first display pad connection hole 190 areformed in the touch insulation layer 158.

Subsequently, by depositing a second conductive layer on the touchinsulation layer 158 including the touch connection hole 150, the firsttouch pad connection hole 178 a, and the first display pad connectionhole 190, and then selectively removing the same, in the active area,each second touch pattern 154 e, which is connected to the second bridge154 b through the touch connection hole 150, each first touch pattern(shown as 152 e of FIG. 4B), which is spaced apart from the second touchpattern 154 e and is arranged in a direction intersecting the secondtouch pattern 154 e, and the first bridge 152 b, which integrallyinterconnects neighboring first touch patterns 152 e, are formed. Inaddition, the second touch pad electrode 174, which is connected to thefirst connection pad electrode 222 thereunder through the first touchpad connection hole 178 a, and the second display pad electrode 186,which is connected to the second connection pad electrode 224 thereunderthrough the first display pad connection hole 190, are formed.

*Manufacturing Method of Third Aspect*

FIGS. 9A to 9G are process cross-sectional views illustrating a methodof manufacturing the organic light-emitting display device having thetouchscreen according to the third aspect of the present disclosure.

As illustrated in FIG. 9A, in a method of manufacturing the organiclight-emitting display device having the touchscreen according to thethird aspect of the present disclosure, first, the switching thin-filmtransistor (shown as T1 in the pixel-driving circuit of FIG. 2) and thedriving thin-film transistor T2 or 130 are formed in each subpixel SP ofthe substrate 111. In the same process, the first touch pad electrode168, which is in the same layer as the data line (shown as DL of FIG.4A) and the source and drain electrodes 136 and 138, and the firstdisplay pad electrode 182, which is spaced apart from the first touchpad electrode 168, are formed. The first touch pad electrode 168 islengthened to the portion LB illustrated in FIGS. 1 and 4 a in thenon-display area to have a pattern line shape having a constant width.In this case, a lengthened portion of the first touch pad electrode 168is disposed so as not to overlap the display link wire 137, which isformed in the same process.

In some cases, the first touch pad electrode 168 and the first displaypad electrode 182 may be formed using different metal layers. In thiscase, one of them may be in the same layer as the scan line SL and thegate electrode 132, and the other one may be in the same layer as thedata line DL and the source and drain electrodes 136 and 138. Thisserves to prevent a short-circuit in the resultant overlapping portioneven if the display link wire 137 and the lengthened first touch padelectrode 168 overlap each other.

Subsequently, the protective layer 116 is formed using an inorganiclayer over the entire surface thereof.

Subsequently, the planarization layer 118 is formed using an organiclayer such as photo-acryl, so as to cover the first touch pad electrode168, the first display pad electrode 182, the switching thin-filmtransistor, and the driving thin-film transistor T2 or 130, in order toplanarize the structure thereunder and to form the light-emittingelement on the top flat surface thereof.

Subsequently, the planarization layer 118 and the protective layer 116are selectively removed to form the pixel connection hole 148, whichexposes the drain electrode 138. In this process, the first touch padconnection hole 178 a and the first display pad connection hole 190 areformed in the pad unit.

Subsequently, as illustrated in FIG. 9B, by depositing a firstconductive layer, which is a reflective electrode, a transparentelectrode, or a lamination thereof, on the planarization layer 118 andthe pad unit from which the planarization layer 118 has been removed,and selectively removing the same, the anode electrode 122 is formed foreach subpixel SP, the first connection pad electrode 322 is formed so asto be connected to the first touch pad electrode 168 through the firsttouch pad connection hole 178 a, and the second connection pad electrode324 is formed so as to be connected to the first display pad electrode182 through the first display pad connection hole 190. In some cases,the formation of the first and second connection pad electrodes 322 and324 may be omitted.

Subsequently, as illustrated in FIG. 9C, the bank 128, a portion ofwhich overlaps the anode electrode 122 to define an emission area, isformed, and the light-emitting stack 124 including the emission layerand the cathode electrode 126 are sequentially formed. Here, the anodeelectrode 122, the light-emitting stack 124, and the cathode electrode126 function as the light-emitting element 120.

The encapsulation layer 140 is formed by alternately laminating theinorganic encapsulation layers 142 and 146 and the organic encapsulationlayer 144 on the substrate 111, on which the cathode electrode 126 hasbeen formed. Here, in order to sufficiently cover the light-emittingelement 120 thereunder, the encapsulation layer 140 covers the entireactive area AA and is lengthened to the non-active area excluding thepad unit so as to cover the display link wire 137, which is formed inadvance (shown in FIG. 4B).

Subsequently, as illustrated in FIG. 9D, the second bridge 154 b isformed in a single layer or in multiple layers to have an island shapeby using a metal having strong corrosion resistance and acid resistance,such as Al, Ti, Cu, and Mo, on the uppermost inorganic encapsulationlayer 146 of the encapsulation layer 140, and simultaneously, the touchlink wire 156 is formed in the non-active area. At this time, the touchlink wire 156, which extends along the sidewall of the encapsulationlayer 140 and enters the non-active area, is spaced apart from the firstconnection pad electrode 322, which constitutes the touch pad TP.

Subsequently, as illustrated in FIG. 9E, the touch insulation layer 158is deposited to have a thickness ranging from 500 Å to 5 μm through adeposition or coating process over the entire surface including thesecond bridge 154 b, the touch link wire 156, and the first and secondconnection pad electrodes 322 and 324. Then, to expose opposite ends ofthe second bridge 154 b and the top portion of the first and secondconnection pad electrodes 322 and 324, the touch connection holes 150,and connection holes at the same positions as the first touch padconnection hole 178 a and the first display pad connection hole 190 areformed in the touch insulation layer 158.

Subsequently, by depositing a second conductive layer on the touchinsulation layer 158 including the touch connection hole 150, the firsttouch pad connection hole 178 a, and the first display pad connectionhole 190, and then selectively removing the same, in the active area,each second touch pattern 154 e, which is connected to the second bridge154 b through the touch connection hole 150, each first touch pattern(see 152 e of FIG. 4B), which is spaced apart from the second touchpattern 154 e and is arranged in a direction intersecting the secondtouch pattern 154 e, and the first bridge 152 b, which integrallyinterconnects neighboring first touch patterns 152 e, are formed. Inaddition, the second touch pad electrode 174, which is connected to thefirst connection pad electrode 322 thereunder through the first touchpad connection hole 178 a, and the second display pad electrode 186,which is connected to the second connection pad electrode 324 thereunderthrough the first display pad connection hole 190, are formed.

Subsequently, as illustrated in FIG. 9F, below the substrate 111, anoverlapping portion of the lengthened first touch pad electrode 168 andthe touch link wire 156 is subjected to laser welding so that a portionof the first touch pad electrode 168 melts and is connected to the touchlink wire 156 thereabove to form the electric connector RTC. Duringlaser welding, the thin protective layer 116 between the touch link wire156 and the first touch pad electrode 168 burns, and the burned regionis filled with the touch pad electrode pattern 168 a as a moltenportion, so that the first touch pad electrode 168, the first touch padelectrode pattern 168 a, and the touch link wire 156, which aresequentially formed from the bottom, are electrically connected to eachother.

Here, the protective layer 116 is a thin protective layer and isselectively removable by adjusting laser energy without having an effecton the other layers during laser welding.

Subsequently, as illustrated in FIG. 9G, in order to apply an electricalsignal to the scan line SL, the data line DL, and the first and secondtouch electrodes 152 and 154, the printed circuit board 1500, whichincludes a drive IC and a touch controller therein, is provided. At thistime, the printed circuit board 1500 includes the bump electrodes 1510and 1520 at positions corresponding to the touch pad TP or 170 and thedisplay pad DP or 180. The anisotropic conductive film 1600 isinterposed between the printed circuit board 1500 and the pad unit PTand DP of the substrate 111 to achieve electrical connection whenpressure is applied to the back side of the flexible printed circuitboard 1500.

Here, in the anisotropic conductive film 1600, the conductive balls 1610are contained in the adhesive layer 1620. When pressure is applied, theconductive balls 1610 are broken so as to achieve electrical connectionbetween the bump electrode 1510 or 1520 and the touch pad 170 or thedisplay pad 180 located thereabove and thereunder.

Meanwhile, the organic light-emitting display device having thetouchscreen according to the present disclosure may further include acolor filter above or below the first and second touch electrodes 152and 154. This will be described below in a fourth aspect.

FIG. 10 is a cross-sectional view illustrating an organic light-emittingdisplay device having a touchscreen according to a fourth aspect of thepresent disclosure.

That is, the organic light-emitting display device having thetouchscreen according to the fourth aspect of the present disclosure, asillustrated in FIG. 10, may include a touch buffer layer 196 or a colorfilter layer 198 between the encapsulation layer 140 and a touchelectrode array including the first and second touch electrodes 152 and154. Here, the touch buffer layer 196 and the color filter layer 198 maybe selectively provided, or may be provided together. In addition, whenall of the two layers are provided, the touch buffer layer 196 may beprovided below the color filter layer 198, or the touch buffer layer 196may be provided above the color filter layer 198, as illustrated.

The touch buffer layer 196 maintains a minimum vertical distance of 5 μmbetween the first and second touch electrodes 152 and 154 and thecathode electrode 126. Thereby, it is possible to minimize the capacityvalue of a parasitic capacitor formed between each of the first andsecond touch electrodes 152 and 154 and the cathode electrode 126, whichmay prevent mutual interaction due to coupling between each of thetouch-sensing line 154 and the touch-driving line 152 and thelight-emitting element 120.

Meanwhile, the organic light-emitting display device of the presentdisclosure has been described as one light-emitting stack 124 beingdisposed between the anode electrode 122 and the cathode electrode 126by way of example, however, two or more light-emitting stacks may bedisposed. For example, as illustrated in FIG. 9, the first and secondlight-emitting stacks 124 a and 124 b may be disposed between the anodeelectrode 122 and the cathode electrode 126. A charge generation layerCGL is disposed between the first and second light-emitting stacks 124 aand 124 b. The first light-emitting stack 124 a includes a holetransport layer HTL1, an organic emission layer EML1, and an electrontransport layer ETL1, which are sequentially formed on the anodeelectrode 122, and the second light-emitting stack 124 b includes a holetransport layer HTL2, an organic emission layer EML2, and an electrontransport layer ETL2, which are sequentially formed on the anodeelectrode 122. Here, one of the emission layer EML1 of the firstlight-emitting stack 124 a and the emission layer EML2 of the secondlight-emitting stack 124 b generates blue light, and the other one ofthe emission layer EML1 of the first light-emitting stack 124 a and theemission layer EML2 of the second light-emitting stack 124 b generatesyellow green light, whereby white light is generated via the first andsecond light-emitting stacks 124 a and 124 b.

Then, the color filter layer 198, which is disposed on the encapsulationlayer 140 above the light-emitting element 120, may perform colordisplay by transmitting white light from the lower side thereof througheach wavelength band.

Here, the color filter layer 198 may be located above any one of thecathode electrode 126, the encapsulation layer 140, and the first andsecond touch electrodes 152 and 154 as long as it is disposed above thecathode electrode 126. In some cases, the color filter layer 198 mayalso be used as the touch insulation layer 158 below the first andsecond touch electrodes 152 and 154.

As is apparent from the above description, an organic light-emittingdisplay device having a touchscreen and a method of manufacturing thesame according to the present disclosure have the following effects.

First, since a touch pad and a display pad are provided on the same sideof a substrate, both the touch pad and the display pad may be connectedvia a single flexible printed circuit board.

Second, since the touch pad and the display pad, which constitute a padunit, have the same lamination structure, when the flexible printedcircuit board is aligned with the pad unit, connection therebetweenwithout a difference in height is possible, which may increase bondingreliability. In addition, in the vertical cross sections of the touchpad and the display pad, areas thereof corresponding to conductive ballshave the same surface height, whereby it is possible to improve the formfactor of circuit components disposed on the substrate.

Third, since the pad unit is provided on only one side of the substrate,it is possible to increase an effective display area, compared to aconventional structure in which a touch pad and a display pad areprovided on different sides.

Although the aspects of the present disclosure have been described abovein detail with reference to the accompanying drawings, it will beapparent to those skilled in the art that the present disclosuredescribed above is not limited to the aspects described above, andvarious substitutions, modifications, and alterations may be devisedwithin the spirit and scope of the present disclosure.

What is claimed is:
 1. An organic light-emitting display devicecomprising: a substrate comprising an active area and a non-active area;a plurality of thin-film transistors disposed in the active area; aplurality of light-emitting elements connected to the plurality ofthin-film transistors in the active area; an encapsulation layerdisposed on the plurality of thin-film transistors and the plurality oflight-emitting elements; a touch electrode array comprising a pluralityof first touch electrodes and a plurality of second touch electrodesarranged on a top of the encapsulation layer to intersect each other inthe active area; at least one display pad and at least one touch padarranged in the non-active area on a same side of the substrate so as tobe parallel to and spaced apart from each other; and a flexible printedcircuit board connected to both the plurality of display pads and theplurality of touch pads.
 2. The device according to claim 1, wherein theat least one display pad includes a plurality of display pad and the atleast one touch pad includes a plurality of touch pads, and wherein thedevice further comprises: a plurality of touch link wires provided inthe non-active area above the encapsulation layer on the substrate andconnecting the plurality of touch pads to the plurality of first touchelectrodes and the plurality of second touch electrodes, respectively;and a plurality of display link wires provided in the non-active areabelow the encapsulation layer on the substrate and connecting theplurality of display pads to the plurality of thin-film transistors,respectively.
 3. The device according to claim 2, wherein the pluralityof touch link wires and plurality of the display link wires have anoverlapping portion by interposing the encapsulation layer therebetween.4. The device according to claim 2, wherein each of the plurality offirst touch electrodes comprises a first touch pattern and a firstbridge, wherein each of the plurality of second touch electrodescomprises a second touch pattern and a second bridge, wherein the firsttouch pattern and the second touch pattern are disposed in the samelayer, wherein the first bridge is integrated with the first touchpattern, and wherein the second bridge is located in a layer differentfrom the first touch pattern and the second touch pattern, interposes atouch insulation layer therebetween at an intersection of the firsttouch electrode and the second touch electrode, and is connected to thesecond touch pattern through a touch connection hole in the touchinsulation layer.
 5. The device according to claim 4, wherein each ofthe plurality of touch pads comprises touch pad electrodes in multiplelayers, and wherein each of the plurality of touch link wires is locatedin the same layer as the second bridge, and is integrated with at leastone layer of the multiple layers in the touch pad electrodes.
 6. Thedevice according to claim 4, wherein each of the plurality of touch padscomprises touch pad electrodes in multiple layers, wherein each of theplurality of touch link wires is located in the same layer as the firstbridge, and wherein at least one touch pad electrode is extended toconnect to each of the plurality of touch link wires.
 7. The deviceaccording to claim 4, wherein each of the plurality of touch padscomprises touch pad electrodes in multiple layers, wherein the organiclight-emitting display device further comprises one or more insulationlayers between the plurality of the touch link wires and at least onetouch pad electrode of the plurality of touch pads, and wherein each ofthe plurality of touch link wires is electrically connected to the atleast one touch pad electrode through a connection hole in the one ormore insulation layers.
 8. The device according to claim 7, wherein theone or more insulation layers between the plurality of touch link wiresand the at least one touch pad electrode of the plurality of touch padsare inorganic layers.
 9. The device according to claim 7, wherein eachof the plurality of display pads comprises a first display pad electrodein the same layer as the plurality of thin-film transistors and a seconddisplay pad electrode in a layer different from the first display padelectrode, and wherein each of the plurality of touch pads comprises afirst touch pad electrode in the same layer as the first display padelectrode and a second touch pad electrode in the same layer as thesecond display pad electrode.
 10. The device according to claim 9,wherein the second display pad electrode and the second touch padelectrode are located in the same layer as the first touch pattern andthe second touch pattern.
 11. The device according to claim 9, whereinthe one or more insulation layers having the connection hole are locatedbetween the first touch pad electrode and each of the plurality of touchlink wires, and the connection hole is located above the first touch padelectrode and below each of the plurality of touch link wires.
 12. Thedevice according to claim 7, further comprising a connection padelectrode located in the same layer as one layer of the plurality oflight-emitting elements between a first touch pad electrode and a secondtouch pad electrode of each of the plurality of touch pads.
 13. Thedevice according to claim 2, wherein each light-emitting elementcomprises: an anode electrode connected to a corresponding one of theplurality of thin-film transistors; a cathode electrode disposed to facethe anode electrode; and at least one light-emitting stack disposedbetween the anode electrode and the cathode electrode and emitting whitelight, and wherein the organic light-emitting display device furthercomprises a color filter disposed above one of the cathode electrode,the encapsulation layer, and the plurality of first and second touchelectrodes.
 14. The device according to claim 1, wherein each of the atleast one display pad and each of the at least one touch pad include alayer in the same layer as a source electrode and a drain electrode inthe plurality of thin-film transistors.
 15. A method of manufacturing anorganic light-emitting display device, the method comprising: forming aplurality of thin-film transistors disposed in an active area of asubstrate; forming a first display pad electrode and a first touch padelectrodes parallel to the first display pad electrodes on a same sideof the substrate in a non-active area located outside the active area;forming a plurality of light-emitting elements connected to theplurality of thin-film transistors in the active area of the substrate;forming an encapsulation layer on the plurality of thin-film transistorsand the plurality of light-emitting elements; forming a touch electrodearray comprising a first touch electrode and a second touch electrodeintersecting each other in the active area above the encapsulationlayer; forming a second display pad electrode and a second touch padelectrode, the second display pad electrode and the second touch padelectrode respectively connected to the first display pad electrode andthe first touch pad electrodes in the non-active area; and connectingthe second display pad electrode and the second touch pad electrode to aflexible printed circuit board.
 16. The method according to claim 15,wherein, the forming the first display pad electrode and the first touchpad electrode further comprises forming a display link wire to connectthe first display pad electrode with the plurality of thin-filmtransistors.
 17. The method according to claim 16, wherein, the formingthe touch electrode array, the second display pad electrode, and thesecond touch pad electrode further comprises forming a touch link wireto connect the first and second touch electrodes, respectively, with thesecond touch pad electrode.
 18. The method according to claim 17,wherein the forming the first and second touch electrodes furthercomprises: forming a plurality of first bridges in the active area onthe encapsulation layer; forming a touch insulation layer having aplurality of touch connection holes corresponding to opposite sides ofeach first bridge; and forming, on the touch insulation layer, aplurality of first touch patterns, which are connected at neighboringopposite sides thereof to the plurality of first bridges through theplurality of touch connection holes, a plurality of second touchpatterns, which are spaced apart from the plurality of first touchpatterns and the plurality of touch connection holes, and a plurality ofsecond bridges, which are located in the same layer as the plurality ofsecond touch patterns and are connected to the plurality of second touchpatterns.
 19. The method according to claim 18, wherein the touch linkwire is formed in the same layer as the plurality of first bridges. 20.The method according to claim 19, wherein the forming the touch linkwire further comprises forming the touch link wire overlapping the firsttouch pad electrode.
 21. The method according to claim 20, furthercomprising electrically connecting the touch link wire to the secondtouch pad electrode by irradiating a laser from a bottom side of thesubstrate to an overlapping portion of the touch link wire and the firsttouch pad electrode.
 22. The method according to claim 20, wherein, theplurality of connection holes in the touch insulation layer exposes thefirst touch pad electrode and the first display pad electrode.